Can be more effective than the conventional LED chip packaging technology Idemitsu. If, however, it is to say in the light-emitting layer and the electrode of the chip below increases the reflective layer to reflect thesolar flashlight  energy of a waste, will result in loss of about 8% of the light reflective layer, so the base plate material must be increased. The chip side surface of the light must also be used to heat the lining of the mirror machining method to be reflected, to increase the device out of the light-receiving rate. The optical combination of surface and in the portion of the sapphire substrate of the flip chip with the epoxy resin derivative should be added to a layer of silicone material, to improve the chip out of the refractive index of the light.
After the improvement of the optical packaging technology, can significantly improve the high-power LED devices the Idemitsu rate (flux). Lens optical design of the top of the high-power LED devices is also very important, the usual practice is: and during optical lens design should take full account of the the final emergency exit lights  fixtures optical design requirements, as far as possible with the application of optical lighting equipment requirements for the design.
Common lens shape: convex lens, a concave cone lens, spherical lens, a Fresnel lens, and a combined lens. Lens with high-power LED devices ideal assembly method is to take a hermetic package, semi-hermetic package can also be taken, if the lens shape. The lens material should be selected high transmittance of synthetic materials such as glass or acrylic, and may also be used conventional epoxy modular package, together with the secondary thermal design which can achieve the effect to improve the light-receiving rate.